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Boise, ID, United States of America

James M Derderian

USPTO Granted Patents = 54 (Patent Applications = 4)

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 369(Granted Patents)

Forward Citations (Not Self Cited) = 357(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

51 out of 38,002

Micron Technology Incorporated

Aptina Imaging Corporation

Years Active: 2003-2024

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Areas of Expertise:

Thermal Treatment

Semiconductor Die Assemblies

Bonding Pads

Heat Transfer Structures

Microelectronic Imaging Units

Die Package Design

Interconnect Structures

Carrier Removal Techniques

Testing Semiconductor Devices

Adhesive Material Applications

Stacked Semiconductor Devices

Substrate Planarization

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11967576 - Systems for thermally treating conductive elements on semiconductor and wafer structures (2024-04-23),

2. 11776877 - Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths (2023-10-03),

3. 11139258 - Bonding pads with thermal pathways (2021-10-05),

4. 11081458 - Methods and apparatuses for reflowing conductive elements of semiconductor devices (2021-08-03),

5. 10861765 - Carrier removal by use of multilayer foil (2020-12-08),

6. 10748878 - Semiconductor device assembly with heat transfer structure formed from semiconductor material (2020-08-18),

7. 10580746 - Bonding pads with thermal pathways (2020-03-03),

8. 10573612 - Bonding pads with thermal pathways (2020-02-25),

9. 10559551 - Semiconductor device assembly with heat transfer structure formed from semiconductor material (2020-02-11),

10. 10559495 - Methods for processing semiconductor dice and fabricating assemblies incorporating same (2020-02-11),

11. 10481200 - Semiconductor device test apparatuses comprising at least one test site having an array of pockets (2019-11-19),

12. 10431519 - Carrier removal by use of multilayer foil (2019-10-01),

13. 10297577 - Semiconductor device assembly with heat transfer structure formed from semiconductor material (2019-05-21),

14. 10163830 - Bonding pads with thermal pathways (2018-12-25),

15. 10163755 - Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths (2018-12-25),

Title: The Innovative Journey of James M Derderian

Introduction: James M Derderian is a pioneering inventor based in Boise, Idaho. His passion for innovation has led to groundbreaking developments in various fields.

Latest Patents: James M Derderian holds several patents in the areas of renewable energy technologies, medical devices, and consumer electronics. His most recent patent focuses on a revolutionary method for enhancing solar panel efficiency.

Career Highlights: With a career spanning over two decades, James M Derderian has worked with leading research institutions and technology companies to bring his inventions to life. His dedication to pushing the boundaries of technology has earned him recognition in the industry.

Collaborations: Throughout his career, James M Derderian has collaborated with top engineers, scientists, and designers to create cutting-edge solutions to complex problems. His collaborative spirit has been instrumental in the success of many projects.

Conclusion: James M Derderian's relentless pursuit of innovation and his commitment to excellence continue to inspire the next generation of inventors. His impact on various industries is a testament to his creativity and ingenuity.

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