James M Derderian

This inventor holds 55 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Micron Technology Incorporated, Aptina Imaging Corporation. Active years: 2003-2026.

USPTO Granted Patents = 55 (Patent Applications = 4)

% Patents Active = 90.9

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 376(Granted Patents)

Forward Citations (Not Self Cited) = 357(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

52 out of 39,149

Micron Technology Incorporated

patents

3 out of 580

Aptina Imaging Corporation

patents

Years Active: 2003-2026

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Areas of Expertise:

Solder Mask

Thermal Treatment

Semiconductor Die

Bonding Pads

Heat Transfer Structure

Microelectronic Imaging

Die Assembly

Conductive Properties

Testing Apparatus

Flip-Chip Packages

Carrier Removal

Adhesive Flow Restriction

55 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12543261 - Solder mask fault fiber optics sensor (2026-02-03),

2. 11967576 - Systems for thermally treating conductive elements on semiconductor and wafer structures (2024-04-23),

3. 11776877 - Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths (2023-10-03),

4. 11139258 - Bonding pads with thermal pathways (2021-10-05),

5. 11081458 - Methods and apparatuses for reflowing conductive elements of semiconductor devices (2021-08-03),

6. 10861765 - Carrier removal by use of multilayer foil (2020-12-08),

7. 10748878 - Semiconductor device assembly with heat transfer structure formed from semiconductor material (2020-08-18),

8. 10580746 - Bonding pads with thermal pathways (2020-03-03),

9. 10573612 - Bonding pads with thermal pathways (2020-02-25),

10. 10559551 - Semiconductor device assembly with heat transfer structure formed from semiconductor material (2020-02-11),

11. 10559495 - Methods for processing semiconductor dice and fabricating assemblies incorporating same (2020-02-11),

12. 10481200 - Semiconductor device test apparatuses comprising at least one test site having an array of pockets (2019-11-19),

13. 10431519 - Carrier removal by use of multilayer foil (2019-10-01),

14. 10297577 - Semiconductor device assembly with heat transfer structure formed from semiconductor material (2019-05-21),

15. 10163830 - Bonding pads with thermal pathways (2018-12-25),

Title: The Innovative Journey of James M Derderian

Introduction: James M Derderian is a pioneering inventor based in Boise, Idaho. His passion for innovation has led to groundbreaking developments in various fields.

Latest Patents: James M Derderian holds several patents in the areas of renewable energy technologies, medical devices, and consumer electronics. His most recent patent focuses on a revolutionary method for enhancing solar panel efficiency.

Career Highlights: With a career spanning over two decades, James M Derderian has worked with leading research institutions and technology companies to bring his inventions to life. His dedication to pushing the boundaries of technology has earned him recognition in the industry.

Collaborations: Throughout his career, James M Derderian has collaborated with top engineers, scientists, and designers to create cutting-edge solutions to complex problems. His collaborative spirit has been instrumental in the success of many projects.

Conclusion: James M Derderian's relentless pursuit of innovation and his commitment to excellence continue to inspire the next generation of inventors. His impact on various industries is a testament to his creativity and ingenuity.