The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Jul. 08, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
James M. Derderian, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/005 (2006.01); B23K 101/40 (2006.01); H01L 21/268 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); B23K 1/0056 (2013.01); H01L 21/268 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/94 (2013.01); B23K 2101/40 (2018.08); H01L 2221/68327 (2013.01); H01L 2224/117 (2013.01); H01L 2224/11849 (2013.01);
Abstract
Methods of reflowing electrically conductive elements on a wafer may involve directing a laser beam toward a region of a surface of a wafer supported on a film of a film frame to reflow at least one electrically conductive element on the surface of the wafer. In some embodiments, the wafer may be detached from a carrier substrate and be secured to the film frame before laser reflow. Apparatus for performing the methods, and methods of repairing previously reflowed conductive elements on a wafer are also disclosed.