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For the Inventor, By the Inventor

Yongin, South Korea

In-Young Lee

This inventor holds 23 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2007-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: In-Young Lee. Retrieved from https://idiyas.com/inventor/in-young-lee-t6pmbwvr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 23 

% Patents Active = 82.6


Average Co-Inventor Count = 4.7

ph-index = 7

Forward Citations = 108(Granted Patents)


Location History:

  • Gyunggi-do, KR (2011 - 2013)
  • Hwaseong-si, KR (2018 - 2019)
  • Yongin-si, KR (2007 - 2021)

Company Filing History:

goldMedal23 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2007-2021

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Areas of Expertise:
Semiconductor Chip
Antenna Device
Dipole Antenna
Through Electrodes
Wafer-Level Package
Heat Spreader
Chip Stack Package
Board On Chip Package
Redistribution Interconnection
Semiconductor Device
Stack Module
Memory Card
23 patents (USPTO):Explore Patents
1. 10930610 - Semiconductor chip including a bump structure and semiconductor package including the same (2021-02-23),
2. 10297909 - Antenna device and electronic device including same (2019-05-21),
3. 9912065 - Dipole antenna module and electronic apparatus including the same (2018-03-06),
4. 9853012 - Semiconductor packages having through electrodes and methods of fabricating the same (2017-12-26),
5. 9412707 - Method of manufacturing semiconductor package (2016-08-09),
6. 9287140 - Semiconductor packages having through electrodes and methods of fabricating the same (2016-03-15),
7. 9245771 - Semiconductor packages having through electrodes and methods for fabricating the same (2016-01-26),
8. 9177942 - Semiconductor package and method of fabricating the same (2015-11-03),
9. 9171825 - Semiconductor device and method of fabricating the same (2015-10-27),
10. 9165916 - Semiconductor package and method of fabricating the same (2015-10-20),
11. 9054228 - Semiconductor packages including a heat spreader and methods of forming the same (2015-06-09),
12. 8941245 - Semiconductor package including semiconductor chip with through opening (2015-01-27),
13. 8482129 - Wafer-level stack package and method of fabricating the same (2013-07-09),
14. 8415804 - Semiconductor chip, method of fabricating the same, and stack module and memory card including the same (2013-04-09),
15. 8119448 - Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same (2012-02-21),

Title: The Innovative Mind of In-Young Lee

Introduction: In-Young Lee is a pioneering inventor hailing from Yongin-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: In-Young Lee holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, In-Young Lee has worked with top research institutions and leading tech companies, consistently pushing the boundaries of what is possible in the world of innovation.

Collaborations: Throughout his career, In-Young Lee has collaborated with fellow inventors, engineers, and scientists from around the globe, fostering a culture of creativity and knowledge-sharing that has led to numerous breakthroughs in technology.

Conclusion: In-Young Lee's passion for innovation, coupled with his dedication to pushing the limits of technological advancement, solidifies his position as a visionary inventor shaping the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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