The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Dec. 16, 2009
Ho-jin Lee, Seoul, KR;
Dong-hyun Jang, Suwon-si, KR;
In-young Lee, Yongin-si, KR;
Min-seung Yoon, Seoul, KR;
Son-kwan Hwang, Suwon-si, KR;
Ho-jin Lee, Seoul, KR;
Dong-hyun Jang, Suwon-si, KR;
In-young Lee, Yongin-si, KR;
Min-seung Yoon, Seoul, KR;
Son-kwan Hwang, Suwon-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.