The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
May. 01, 2015
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Hyun-soo Chung, Hwaseong-si, KR;
Tae-je Cho, Yongin-si, KR;
Jung-seok Ahn, Seoul, KR;
In-young Lee, Yongin-si, KR;
Abstract
Embodiments of the inventive aspect include a method of manufacturing a semiconductor package including a plurality of stacked semiconductor chips in which edges of a semiconductor wafer substrate may be prevented from being damaged or cracked when the semiconductor package is manufactured at a wafer level, while a diameter of a molding element is greater than a diameter of the semiconductor wafer substrate. The molding element may cover a surface of the wafer substrate and the plurality of stacked semiconductor chips. Embodiments may include a wafer level semiconductor package including a circular substrate having a first diameter, a circular passivation layer attached to the circular substrate, the passivation layer having the first diameter, and a circular molding element covering surfaces of the plurality of semiconductor chips, and covering an active area of the substrate. The circular molding element may have a second diameter that is greater than the first diameter.