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For the Inventor, By the Inventor

Hwaseong-si, South Korea

Hyun-Soo Chung

USPTO Granted Patents = 43 

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 244(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2009 - 2012)
  • Hwasung, KR (2009 - 2013)
  • Gyunggi-do, KR (2011 - 2013)
  • Hwaseong-si, KR (2007 - 2023)

Company Filing History:

goldMedal43 out of 131,744 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2007-2023

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Areas of Expertise:
Semiconductor Chips
Wafer-Level Packages
Chip Stack Packages
Redistribution Wiring
Through Silicon Vias
Interconnection Structures
Multi-Chip Packages
Joint Reliability
Fabrication Methods
Cooling Path
Bump Structures
Stress Relief Spacers
43 patents (USPTO):Explore Patents
1. 11705376 - Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad (2023-07-18),
2. 11189535 - Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad (2021-11-30),
3. 11031347 - Semiconductor packages (2021-06-08),
4. 10930610 - Semiconductor chip including a bump structure and semiconductor package including the same (2021-02-23),
5. 10840159 - Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad (2020-11-17),
6. 10438899 - Semiconductor packages (2019-10-08),
7. 10008462 - Semiconductor package (2018-06-26),
8. 9698051 - Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages (2017-07-04),
9. 9412707 - Method of manufacturing semiconductor package (2016-08-09),
10. 8957526 - Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages (2015-02-17),
11. 8952543 - Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices (2015-02-10),
12. 8735281 - Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same (2014-05-27),
13. 8735276 - Semiconductor packages and methods of manufacturing the same (2014-05-27),
14. 8637989 - Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes (2014-01-28),
15. 8482129 - Wafer-level stack package and method of fabricating the same (2013-07-09),

Title: Innovations by Inventor Hyun-Soo Chung in Semiconductor Technology

Introduction: Hyun-Soo Chung, based in Hwaseong-si, South Korea, is a prominent inventor with an impressive portfolio of 43 patents. His expertise lies in semiconductor technology, where his innovations have made significant impacts in the industry.

Latest Patents: Among his latest contributions, Hyun-Soo Chung has developed a semiconductor chip that includes a chip pad, a redistribution wiring test pad, and a redistribution wiring connection pad. This cutting-edge semiconductor chip is designed with a chip pad positioned in the first region of the chip body. It also features a redistribution wiring test pad, strategically placed apart from the chip pad and connected through a redistribution wiring structure. Additionally, the semiconductor chip incorporates a redistribution wiring connection pad, which may be situated in the first or second region of the chip body, also connected to the chip pad via the redistribution wiring structure. This innovation enhances the functionality and efficiency of semiconductor devices.

Career Highlights: Throughout his career, Hyun-Soo Chung has gained valuable experience working with major companies like Samsung Electronics Co., Ltd. His tenure at these influential organizations has allowed him to hone his skills and contribute to the development of advanced semiconductor technologies.

Collaborations: Hyun-Soo Chung has collaborated with talented individuals such as Ho-jin Lee and Dong-Ho Lee. These collaborations have fostered a collaborative environment that drives innovation and results in cutting-edge technology advancements within the semiconductor field.

Conclusion: Hyun-Soo Chung stands out as a leading figure in semiconductor innovation, with numerous patents that underscore his contributions to the field. His dedication to advancing semiconductor technology through collaboration and creativity continues to shape the industry, making his work significant in the pursuit of technological progress.

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