The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Aug. 08, 2012
Applicants:
Ho-jin Lee, Seoul, KR;
Hyun-soo Chung, Hwaseong-si, KR;
Chang-seong Jeon, Hwaseong-si, KR;
Sang-sick Park, Hwaseong-si, KR;
Jae-hyun Phee, Yongin-si, KR;
Inventors:
Ho-jin Lee, Seoul, KR;
Hyun-soo Chung, Hwaseong-si, KR;
Chang-seong Jeon, Hwaseong-si, KR;
Sang-sick Park, Hwaseong-si, KR;
Jae-hyun Phee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a semiconductor substrate and a via electrode. The via electrode has a first portion on the substrate and extends towards the substrate and has a plurality of spikes that extends from the first portion into the substrate, each of the spikes being spaced apart form one another.