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For the Inventor, By the Inventor

Hwaseong, South Korea

Chang-Seong Jeon

This inventor holds 9 USPTO granted patents and 5 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-Seong Jeon. Retrieved from https://idiyas.com/inventor/chang-seong-jeon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 100.0

Average Co-Inventor Count = 4.5

ph-index = 5

Forward Citations = 34(Granted Patents)


Location History:

  • Seongnam-si, KR (2015)
  • Hwaseong-si, KR (2014 - 2016)
  • Yongin-si, KR (2015 - 2020)

Company Filing History:

goldMedal9 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2014-2020

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9 patents (USPTO):Explore Patents
1. 10867857 - Method of cutting substrate and method of singulating semiconductor chips (2020-12-15),
2. 9461029 - Semiconductor packages and methods for fabricating the same (2016-10-04),
3. 9245787 - Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same (2016-01-26),
4. 9177942 - Semiconductor package and method of fabricating the same (2015-11-03),
5. 9082871 - Substrate of semiconductor package and method of fabricating semiconductor package using the same (2015-07-14),
6. 8987904 - Substrate of semiconductor package and method of fabricating semiconductor package using the same (2015-03-24),
7. 8697494 - Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method (2014-04-15),
8. 8637989 - Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes (2014-01-28),
9. 8637350 - Method of manufacturing chip-stacked semiconductor package (2014-01-28),

Title: Innovations by Chang-Seong Jeon

Introduction

Chang-Seong Jeon is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work focuses on innovative methods for cutting substrates and fabricating semiconductor packages.

Latest Patents

One of his latest patents is titled "Method of cutting substrate and method of singulating semiconductor chips." This invention involves a process that selectively forms a passivation layer in the device region of a substrate, applies a self-assembled monolayer on the passivation layer, and performs plasma cutting in the scribe lane region. Another notable patent is "Semiconductor packages and methods for fabricating the same." This patent describes a semiconductor package that includes a first semiconductor chip with a molding layer and a second semiconductor chip stacked on it. The design allows for an overhang portion of the second semiconductor chip, which enhances the functionality of the package.

Career Highlights

Chang-Seong Jeon is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

He has collaborated with notable coworkers such as Teak-Hoon Lee and Sang-Sick Park, further enhancing the innovative environment at Samsung Electronics.

Conclusion

Chang-Seong Jeon is a key figure in semiconductor innovation, with a strong portfolio of patents that reflect his expertise and contributions to the industry. His work continues to influence the development of advanced semiconductor technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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