The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Sep. 23, 2011
Chang-seong Jeon, Hwaseong-si, KR;
Ho-geon Song, Suwon-si, KR;
Mitsuo Umemoto, Seongnam-si, KR;
Sang-sick Park, Hwaseong-si, KR;
Chang-Seong Jeon, Hwaseong-si, KR;
Ho-Geon Song, Suwon-si, KR;
Mitsuo Umemoto, Seongnam-si, KR;
Sang-Sick Park, Hwaseong-si, KR;
Samsung Electronics Co., Ltd, Suwon-si, KR;
Abstract
A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.