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For the Inventor, By the Inventor

Gunma, Japan

Mitsuo Umemoto

This inventor holds 33 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Sanyo Electric Co., Ltd., Rohm Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.. Active years: 2006-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsuo Umemoto. Retrieved from https://idiyas.com/inventor/mitsuo-umemoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33

% Patents Active = 97.0


Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 272(Granted Patents)


Location History:

  • Moriguchi, JP (2007)
  • Gunma, JP (2006 - 2010)
  • Gunma-ken, JP (2011)
  • Ibaraki, JP (2007 - 2012)
  • Osaka, JP (2006 - 2013)
  • Ora-gun, JP (2007 - 2015)
  • Gyeonggi-Do, KR (2010 - 2018)
  • Seongnam-si, KR (2014 - 2018)

Company Filing History:

goldMedal22 out of 8,782 
 
Sanyo Electric Co., Ltd.
 patents
silverMedal10 out of 6,021 
 
Rohm Co., Ltd.
 patents
bronzeMedal7 out of 39 
 
Kanto Sanyo Semiconductors Co., Ltd.
 patents
4. 6 out of 3,781 
 
Renesas Technology Corp.
 patents
5. 5 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
6. 3 out of 53,250 
 
Kabushiki Kaisha Toshiba
 patents
7. 3 out of 36,676 
 
Nec Corporation
 patents
8. 3 out of 3,720 
 
Semiconductor Components Industries, LLC
 patents
9. 2 out of 467 
 
Fujitsu Microelectronics Limited
 patents
10. 1 out of 39,371 
 
Fujitsu Corporation
 patents
11. 1 out of 6 
 
Kanto Sanyo Semiconductor Co., Ltd.
 patents
12. 1 out of 21,351 
 
Mitsubishi Denki Kabushiki Kaisha
 patents
13. 2 out of 834,453 
Other
 patents
where one patent can have more than one assignee

Years Active: 2006-2018

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Areas of Expertise:
Semiconductor Package
Heat Dissipation Layer
Fabrication Method
Flip Chip Package
Sensed-Data Processor
Manufacturing Method
Stack Module
Peeling Prevention Layer
Via Hole
Device Production
33 patents (USPTO):Explore Patents
1. 10105102 - Package for processing sensed-data, sensed-data processor, and system for processing sensed-data (2018-10-23),
2. 9991245 - Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same (2018-06-05),
3. 9917010 - Semiconductor device manufacturing method (2018-03-13),
4. 9589842 - Semiconductor package and method of fabricating the same (2017-03-07),
5. 9165898 - Method of manufacturing semiconductor device with through hole (2015-10-20),
6. 8736047 - Semiconductor device and manufacturing method thereof (2014-05-27),
7. 8697494 - Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method (2014-04-15),
8. 8552545 - Manufacturing method for semiconductor device, semiconductor device and semiconductor chip (2013-10-08),
9. 8404586 - Manufacturing method for semiconductor device (2013-03-26),
10. 8089163 - Semiconductor device production method and semiconductor device (2012-01-03),
11. 8076755 - Semiconductor device and method of manufacturing the same (2011-12-13),
12. 8004848 - Stack module, card including the stack module, and system including the stack module (2011-08-23),
13. 7906430 - Method of manufacturing a semiconductor device with a peeling prevention layer (2011-03-15),
14. 7750478 - Semiconductor device with via hole of uneven width (2010-07-06),
15. 7732925 - Semiconductor device and manufacturing method thereof (2010-06-08),

Title: The Innovative Journey of Mitsuo Umemoto

Introduction: Mitsuo Umemoto is a renowned inventor hailing from Gunma, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Mitsuo Umemoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Mitsuo Umemoto has worked with leading research institutions and tech companies, playing a pivotal role in the development of cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Mitsuo Umemoto has collaborated with top engineers, scientists, and inventors from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Mitsuo Umemoto's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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