The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Mar. 28, 2007
Hideaki Yoshimi, Gunma, JP;
Mitsuo Umemoto, Gyeonggi-Do, KR;
Kazumi Onda, Saitama, JP;
Kazumi Horinaka, Saitama, JP;
Hideaki Yoshimi, Gunma, JP;
Mitsuo Umemoto, Gyeonggi-Do, KR;
Kazumi Onda, Saitama, JP;
Kazumi Horinaka, Saitama, JP;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate. Moreover, the heat sink has a thickness of 500 μm to 2 mm, and may be formed to be thicker than the semiconductor substrate. By using the heat sink to reinforce the substrate, a thickness of the semiconductor substrate can be reduced to, for example, about 50 μm. As a result, a thickness of the entire semiconductor device can be reduced.