The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Dec. 03, 2015
Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
Applicants:
Jae Choon Kim, Incheon, KR;
Donghan Kim, Osan-si, KR;
Jikho Song, Seoul, KR;
Mitsuo Umemoto, Seongnam-si, KR;
Inho Choi, Seoul, KR;
Inventors:
Jae Choon Kim, Incheon, KR;
Donghan Kim, Osan-si, KR;
Jikho Song, Seoul, KR;
Mitsuo Umemoto, Seongnam-si, KR;
Inho Choi, Seoul, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/5389 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar.