IDiyas

For the Inventor, By the Inventor

Incheon, South Korea

Jae Choon Kim

USPTO Granted Patents = 26 

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 67(Granted Patents)


Location History:

  • Hwasung, KR (2014 - 2017)
  • Incheon, KR (2015 - 2021)
  • Hwasung-si, KR (2022)
  • Yeonsu-gu, KR (2021 - 2023)

Company Filing History:

goldMedal26 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2014-2025

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26 patents (USPTO):
1. 12469764 - Semiconductor package (2025-11-11),
2. 12142544 - Semiconductor package (2024-11-12),
3. 12125766 - Thermoelectric cooling packages (2024-10-22),
4. 11600608 - Semiconductor package (2023-03-07),
5. 11502059 - Semiconductor package including a thermal pillar and heat transfer film (2022-11-15),
6. 11205604 - Semiconductor package including a thermal conductive layer and method of manufacturing the same (2021-12-21),
7. 11004760 - Chip structure operating method including heating elements to reduce temperature variation (2021-05-11),
8. 10985152 - Semiconductor package (2021-04-20),
9. 10937771 - Semiconductor packages (2021-03-02),
10. 10790213 - Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same (2020-09-29),
11. 10658266 - Thermoelectric cooling packages and thermal management methods thereof (2020-05-19),
12. 10553513 - Chip structure including heating element (2020-02-04),
13. 10510737 - Semiconductor package (2019-12-17),
14. 10347611 - Semiconductor packages having redistribution substrate (2019-07-09),
15. 10198049 - Surface temperature management method of mobile device and memory thermal management method of multichip package (2019-02-05),

Title: Innovations by Jae Choon Kim in Semiconductor Technology

Introduction: Jae Choon Kim is a prolific inventor based in Incheon, South Korea, who has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 25 patents, his work focuses on innovative semiconductor packaging solutions that enhance performance and efficiency.

Latest Patents: Among his latest patents, Jae Choon Kim has developed a semiconductor package that features vertically-stacked semiconductor chips integrated with first, second, and third connection terminals. This innovative design allows for optimized connectivity between semiconductor chips, enhancing their functionality. Each chip incorporates a semiconductor substrate and an interconnection layer, complete with penetration electrodes and multiple groups for interconnection. Another significant invention is the thermoelectric cooling package, which consists of a first package substrate housing a semiconductor chip, surrounded by a molding member and a thermoelectric cooling layer. This layer is designed to improve thermal management, showcasing his commitment to addressing challenges in semiconductor applications.

Career Highlights: Jae Choon Kim has spent his career at Samsung Electronics Co., Ltd., a leading company in the semiconductor industry. His work there reflects his dedication to advancing technology, particularly through the innovative packaging of semiconductor devices. His patents speak to his deep understanding of semiconductor functionality, which contributes to Samsung's reputation for industry leadership.

Collaborations: Throughout his career, Jae Choon Kim has collaborated with talented individuals like Jichul Kim and Eunseok Cho. These partnerships have fostered a creative environment conducive to developing cutting-edge technologies in semiconductor applications.

Conclusion: Jae Choon Kim stands out as a leading inventor in semiconductor technology, with a robust portfolio of patents that illustrate his visionary approach to innovation. His contributions not only enhance the capabilities of semiconductor packages but also signal progressive advancements within the industry.

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