The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Mar. 17, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jichul Kim, Seoul, KR;
Chajea Jo, Yongin-si, KR;
Sang-Uk Han, Hwaseong-si, KR;
Kyoung Soon Cho, Yeonsu-Gu, KR;
Jae Choon Kim, Yeonsu-Gu, KR;
Woohyun Park, Seongnam-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 23/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 23/18 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.