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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11205604 B1

PDFFull Text
Date of Patent:
Dec. 21, 2021

Filed:

Oct. 01, 2018

Semiconductor package including a thermal conductive layer and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Choon Kim, Incheon, KR;

Woo Hyun Park, Seongnam-si, KR;

Eon Soo Jang, Hwaseong-si, KR;

Young Sang Cho, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Latanya N Crawford Eason

Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/13 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 23/49816 (2013.01); H01L 25/105 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/211 (2013.01); H01L 2224/221 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01);
Abstract

A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected to the semiconductor chip, a thermal conductive layer disposed on the second surface of the semiconductor chip, a sealing layer surrounding a side surface of the semiconductor chip and a side surface of the thermal conductive layer, and a second redistribution portion disposed on the sealing layer, the second redistribution portion including a first upper wiring layer connected to the thermal conductive layer, the second redistribution portion including a second upper wiring layer electrically connected to the semiconductor chip.

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