The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Jun. 19, 2015
Hye-young Jang, Yongin-si, KR;
Chang-seong Jeon, Yongin-si, KR;
Chajea JO, Incheon, KR;
Taeje Cho, Yongin-si, KR;
Hye-young Jang, Yongin-si, KR;
Chang-Seong Jeon, Yongin-si, KR;
Chajea Jo, Incheon, KR;
Taeje Cho, Yongin-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package may include a first semiconductor chip including a first surface facing a package substrate, a second surface opposite to the first surface, and at least one through-electrode penetrating the first semiconductor chip, a molding layer molding the first semiconductor chip and exposing the second surface of the first semiconductor chip, a second semiconductor chip stacked on the second surface of the first semiconductor chip, and a non-conductive film provided between the first and second semiconductor chips. The second semiconductor chip includes an overhang portion extending past an edge of the first semiconductor chip. For example, a size of the second semiconductor chip may be greater than that of the first semiconductor chip, so the second semiconductor chip has an overhang. The second semiconductor chip includes at least one interconnecting terminal electrically connected to the at least one through-electrode.