The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Aug. 13, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Chang-Seong Jeon, Yongin-si, KR;
Seung-Hun Shin, Cheonan-si, KR;
Jae-Kyung Yoo, Seoul, KR;
Teak-Hoon Lee, Jung-Gu, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/3065 (2006.01); H01L 21/56 (2006.01); H01L 21/308 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/56 (2013.01); H01L 21/6836 (2013.01);
Abstract
A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.
Jeon, Chang-Seong. (2020). Method of cutting substrate and method of singulating semiconductor chips (U.S. Patent No. 10867857). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10867857
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