The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Feb. 11, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Gi-Jun Park, Seoul, KR;
Won-Keun Kim, Hwaseong-si, KR;
Teak-Hoon Lee, Hwaseong-si, KR;
Chang-Seong Jeon, Seongnam-si, KR;
Young-Kun Jee, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/673 (2006.01); H01L 23/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/56 (2013.01); H01L 21/50 (2013.01); H01L 21/563 (2013.01); H01L 21/673 (2013.01); H01L 21/67346 (2013.01); H01L 23/48 (2013.01); H01L 23/49816 (2013.01);
Abstract
A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.