This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014-2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014-2016
Title: Young-Kun Jee: Innovator in Semiconductor Packaging
Introduction
Young-Kun Jee is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on enhancing the reliability and performance of semiconductor packages, which are crucial components in modern electronics.
Latest Patents
Among his latest patents, one notable invention is a semiconductor package and method of manufacturing the same. This invention features a circuit substrate with multiple semiconductor chips stacked on it. Insulating adhesive patterns are interposed between the chips, and a heat slug is adhered to the uppermost chip using a heat dissipative adhesive pattern. This design aims to reduce failures during the manufacturing process of the mold structure, thereby improving the operating characteristics and reliability of the semiconductor package.
Another significant patent involves semiconductor packages that incorporate through-silicon vias (TSVs) and an adhesive layer. In this design, a first semiconductor chip is placed on a substrate and features several TSVs. A second semiconductor chip with an active layer is positioned on top of the first chip, with an adhesive layer in between. This configuration allows connection terminals to extend through the adhesive layer, connecting to both the TSVs and the active layer, ensuring efficient performance.
Career Highlights
Young-Kun Jee is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's innovative product offerings.
Collaborations
Throughout his career, Young-Kun Jee has collaborated with notable colleagues, including Teak-Hoon Lee and Gi-Jun Park. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Young-Kun Jee's contributions to semiconductor packaging have established him as a key figure in the field. His innovative patents and work at Samsung Electronics Co., Ltd. continue to influence the industry, enhancing the reliability and performance of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile