The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jul. 17, 2012
Young-kun Jee, Suwon-si, KR;
Sun-kyoung Seo, Suwon-si, KR;
Sang-wook Park, Hwaseong-si, KR;
Ji-hwan Hwang, Asan-si, KR;
Young-kun Jee, Suwon-si, KR;
Sun-kyoung Seo, Suwon-si, KR;
Sang-wook Park, Hwaseong-si, KR;
Ji-hwan Hwang, Asan-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad.