Asan-si, South Korea

Ji-hwan Hwang

USPTO Granted Patents = 3 

Average Co-Inventor Count = 5.2

ph-index = 2

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 2012-2014

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3 patents (USPTO):Explore Patents

Title: Ji-hwan Hwang: Innovator in Semiconductor Technology

Introduction

Ji-hwan Hwang is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work primarily focuses on innovative packaging solutions that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Hwang's latest patents include groundbreaking technologies such as the "Stack package and semiconductor package including the same." This invention features a stack package usable in a three-dimensional (3D) system-in-package (SIP), which includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip is equipped with a through silicon via (TSV), allowing the second semiconductor chip to be stacked on top and electrically connected through the TSV. Additionally, the supporter is designed to be spaced apart from the edge of the second semiconductor chip, optimizing the overall structure.

Another notable patent is the "Semiconductor package having an anti-contact layer." This invention comprises a first semiconductor chip and a second semiconductor chip positioned on the first. A connection member is utilized to electrically connect the two chips, featuring a connection pad on the first chip and a connection pillar on the second. An anti-contact layer is formed on at least one surface of the connection pad, enhancing the reliability of the connection.

Career Highlights

Ji-hwan Hwang is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role involves developing advanced semiconductor packaging technologies that are crucial for modern electronic devices. Hwang's innovative approach has positioned him as a key player in the semiconductor industry.

Collaborations

Hwang has collaborated with notable colleagues, including Chung-sun Lee and Jung-Hwan Kim. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Ji-hwan Hwang's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the development of efficient and reliable semiconductor devices, making a lasting impact on the industry.

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