The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jun. 26, 2012
Chang-cheol Lee, Hwaseong-si, KR;
Hyun-jun Kim, Hwaseong-si, KR;
In-young Lee, Yongin-si, KR;
Ki-kwon Jeong, Cheonan-si, KR;
Chang-Cheol Lee, Hwaseong-si, KR;
Hyun-Jun Kim, Hwaseong-si, KR;
In-Young Lee, Yongin-si, KR;
Ki-Kwon Jeong, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package comprises a substrate having a first opening formed therethrough, a first semiconductor chip stacked on the substrate in a flip chip manner and having a second opening formed therethrough, a second semiconductor chip stacked on the first semiconductor chip in a flip chip manner and having a third opening formed therethrough, and a molding material covering the first semiconductor chip and the second semiconductor chip and filling up a space between the substrate and the first semiconductor chip, a space between the first semiconductor chip and the second semiconductor chip, and filling each of the first opening, the second opening, and the third opening.