Hsinchu, Taiwan

Hun-Jan Tao

USPTO Granted Patents = 137 

Average Co-Inventor Count = 3.4

ph-index = 21

Forward Citations = 2,537(Granted Patents)


Inventors with similar research interests:


Location History:

  • Hsinchu Hsien, TW (2004)
  • Hsin-chu, TW (1997 - 2015)

Company Filing History:


Years Active: 1997-2015

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137 patents (USPTO):

Title: The Inventive Journey of Hun-Jan Tao: Paving the Way with Patents

Introduction:

In the world of innovations and patents, Hun-Jan Tao has emerged as a prolific inventor, contributing significantly to the field of integrated circuit structures. Hailing from Hsinchu, Taiwan, Tao has an impressive portfolio of 137 patents, with his latest inventions focused on enhancing the ILD (Interlayer Dielectric) gap-fill window. This article delves into his career highlights and collaborations, shedding light on his notable contributions to the field.

Latest Patents:

Among his impressive array of patents, two recent innovations stand out: "Sidewall free CESL for enlarging ILD gap-fill window" and "Sidewall-free CESL for enlarging ILD gap-fill window." Both integrated circuit structures involve a first gate strip, a gate spacer, and a contact etch stop layer (CESL). Notably, these inventions introduce a unique aspect where a portion of the sidewall of the gate spacer is devoid of CESL, enabling a larger gap-fill window for the ILD.

Career Highlights:

Throughout his career, Tao has worked with renowned companies at the forefront of the semiconductor industry. Notably, he has made significant contributions during his tenure at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. At TSMC, Tao applied his innovative ideas and expertise, resulting in numerous patents that have advanced the efficiency and performance of integrated circuits.

Collaborations:

Innovation thrives on collaboration, and Hun-Jan Tao has had the opportunity to work alongside some notable individuals in the field. One of his important collaborations was with Chia-Shiung Tsai, a fellow inventor renowned for his work in integrated circuits and semiconductor technologies. Another noteworthy association was with Yuan-Hung Chiu, who has made significant contributions to the development of advanced semiconductor processing techniques. These collaborations reflect Tao's dedication to pushing the boundaries of innovation through teamwork.

Conclusion:

Hun-Jan Tao's journey as an inventor has been truly remarkable. With a vast number of patents to his name, his contributions have undoubtedly influenced the field of integrated circuit structures. Through his latest patents focusing on enlarging ILD gap-fill windows, he has demonstrated a keen understanding of industry challenges and a commitment to finding novel solutions. As Tao continues to expand his inventive prowess, we can expect further advancements in integrated circuit technologies, inspiring new possibilities for the industry as a whole.

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