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For the Inventor, By the Inventor

Hsinchu County, Taiwan

Huang-Wen Tseng

USPTO Granted Patents = 25 

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 21(Granted Patents)


Location History:

  • Hsinchu, TW (2020)
  • Hsinchu County, TW (2019 - 2023)
  • Zhubei, TW (2018 - 2024)

Company Filing History:

goldMedal25 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2024

where 'Filed Patents' based on already Granted Patents

25 patents (USPTO):
1. 12183655 - Semiconductor device with enhanced thermal dissipation and method for making the same (2024-12-31),
2. 12027433 - Semiconductor package and method for making the same (2024-07-02),
3. 11993512 - Dual micro-electro mechanical system and manufacturing method thereof (2024-05-28),
4. 11908884 - Inductive device (2024-02-20),
5. 11854913 - Method for detecting defects in semiconductor device (2023-12-26),
6. 11837526 - Semiconductor package structure and method for manufacturing the same (2023-12-05),
7. 11804433 - Semiconductor package structure and method for forming the same (2023-10-31),
8. 11776919 - Semiconductor package (2023-10-03),
9. 11721597 - Semiconductor device and manufacturing method of the same (2023-08-08),
10. 11672181 - Magnetic random access memory (2023-06-06),
11. 11626343 - Semiconductor device with enhanced thermal dissipation and method for making the same (2023-04-11),
12. 11482461 - Semiconductor package and method for making the same (2022-10-25),
13. 11450626 - Semiconductor package (2022-09-20),
14. 11417670 - Structure and method for single gate non-volatile memory device (2022-08-16),
15. 11322576 - Inductive device (2022-05-03),

Title: Innovations in Semiconductor Technology: Huang-Wen Tseng

Introduction

Huang-Wen Tseng, an esteemed inventor based in Hsinchu County, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 25 patents, Tseng's work focuses on enhancing thermal dissipation in semiconductor devices, which is critical for improving performance and reliability in electronic components.

Latest Patents

Among his latest innovations, Tseng has patented a novel semiconductor device designed for enhanced thermal dissipation. This method involves forming a solder layer on the surface of one or more chips, which allows for a robust heat management solution. By applying heat and pressure to melt the solder layer, he successfully attaches a lid to each corresponding chip, utilizing solder with a thermal conductivity of ≥50 W/mK.

Additionally, Tseng has developed a semiconductor package that features a semiconductor chip mounted on a first substrate. This package includes a lid over the chip and spacers that extend through holes in the substrate, providing structural integrity and effective thermal management.

Career Highlights

Currently, Huang-Wen Tseng is employed with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading entity in the semiconductor industry. His innovations have not only contributed to the company's success but have also influenced the broader market for advanced semiconductor technologies.

Collaborations

Tseng has collaborated with talented colleagues such as Yang-Che Chen and Chen-Hua Lin, which has fostered a productive working environment. These partnerships have been integral to the development of cutting-edge technologies, helping to propel the innovations forward within TSMC.

Conclusion

Huang-Wen Tseng exemplifies the spirit of innovation in the semiconductor industry. His contributions, particularly in thermal management solutions, continue to pave the way for advancements in technology. With a firm foundation in research and collaboration, Tseng remains a key figure driving progress in semiconductor applications.

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