This inventor holds 27 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hsinchu, TW (2020)
- Hsinchu County, TW (2019 - 2023)
- Zhubei, TW (2018 - 2024)
Company Filing History:
Years Active: 2018-2026
Areas of Expertise:
Title: Innovations in Semiconductor Technology: Huang-Wen Tseng
Introduction
Huang-Wen Tseng, an esteemed inventor based in Hsinchu County, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 25 patents, Tseng's work focuses on enhancing thermal dissipation in semiconductor devices, which is critical for improving performance and reliability in electronic components.
Latest Patents
Among his latest innovations, Tseng has patented a novel semiconductor device designed for enhanced thermal dissipation. This method involves forming a solder layer on the surface of one or more chips, which allows for a robust heat management solution. By applying heat and pressure to melt the solder layer, he successfully attaches a lid to each corresponding chip, utilizing solder with a thermal conductivity of ≥50 W/mK.
Additionally, Tseng has developed a semiconductor package that features a semiconductor chip mounted on a first substrate. This package includes a lid over the chip and spacers that extend through holes in the substrate, providing structural integrity and effective thermal management.
Career Highlights
Currently, Huang-Wen Tseng is employed with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading entity in the semiconductor industry. His innovations have not only contributed to the company's success but have also influenced the broader market for advanced semiconductor technologies.
Collaborations
Tseng has collaborated with talented colleagues such as Yang-Che Chen and Chen-Hua Lin, which has fostered a productive working environment. These partnerships have been integral to the development of cutting-edge technologies, helping to propel the innovations forward within TSMC.
Conclusion
Huang-Wen Tseng exemplifies the spirit of innovation in the semiconductor industry. His contributions, particularly in thermal management solutions, continue to pave the way for advancements in technology. With a firm foundation in research and collaboration, Tseng remains a key figure driving progress in semiconductor applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile