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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11482461 B1

PDFFull Text
Date of Patent:
Oct. 25, 2022

Filed:

Oct. 29, 2020

Semiconductor package and method for making the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yang-Che Chen, Hsinchu, TW;

Chen-Hua Lin, Douliu, TW;

Huang-Wen Tseng, Zhubei, TW;

Victor Chiang Liang, Hsinchu, TW;

Chwen-Ming Liu, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 21/52 (2013.01); H01L 23/06 (2013.01); H01L 23/14 (2013.01); H01L 23/49816 (2013.01); H01L 24/14 (2013.01); H01L 2021/60022 (2013.01);
Abstract

A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

Find Patent Forward Citations

Chen, Yang-Che. (2022). Semiconductor package and method for making the same (U.S. Patent No. 11482461). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11482461

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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