The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Mar. 14, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yang-Che Chen, Hsinchu, TW;
Victor Chiang Liang, Hsinchu, TW;
Chen-Hua Lin, Douliu, TW;
Chwen-Ming Liu, Hsinchu, TW;
Huang-Wen Tseng, Zhubei, TW;
Yi-Chuan Teng, Zhubei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/04 (2006.01); B81C 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/04 (2013.01); B81C 3/001 (2013.01); B81B 2201/033 (2013.01); B81B 2203/0136 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/04 (2013.01); B81C 1/00357 (2013.01); B81C 1/00468 (2013.01); B81C 1/00476 (2013.01); B81C 1/00484 (2013.01); B81C 2201/0132 (2013.01); B81C 2203/038 (2013.01);
Abstract
A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.