The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Aug. 30, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Yang-Che Chen, Hsin-Chu, TW;

Chen-Hua Lin, Yunlin County, TW;

Victor Chiang Liang, Hsinchu, TW;

Huang-Wen Tseng, Hsinchu County, TW;

Chwen-Ming Liu, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/40 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 22/14 (2013.01); H01L 23/4006 (2013.01); H01L 23/585 (2013.01); H01L 24/20 (2013.01); H01L 24/13 (2013.01); H01L 25/0655 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/221 (2013.01); H01L 2224/2205 (2013.01);
Abstract

A semiconductor device and a method for detecting a defect in a semiconductor device are provided. The semiconductor device includes a packaging structure. The packaging structure includes a redistribution layer and a detecting component disposed in the redistribution layer. The semiconductor device further includes a cooling plate over the packaging structure and a fixing component penetrating through the packaging structure and the cooling plate. The packaging structure and the cooling plate are fixed by the fixing component. The detecting component is in a chain configuration having a ring shaped structure circling around the fixing component.


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