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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Hsu-Nan Fang

This inventor holds 31 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsu-Nan Fang. Retrieved from https://idiyas.com/inventor/hsu-nan-fang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 93.5

Average Co-Inventor Count = 1.5

ph-index = 2

Forward Citations = 29(Granted Patents)


Company Filing History:

goldMedal31 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2019-2026

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Areas of Expertise:
Semiconductor Package
Manufacturing Method
Package Structure
Electronic Package
Optoelectronic Package
Thermal Conducting Material
Stacked Die
Substrate Structure
Interposer
Alignment Material
Device Structure
Assembly Structure
31 patents (USPTO):Explore Patents
1. 12550654 - Method for manufacturing semiconductor package (2026-02-10),
2. 12249578 - Semiconductor package structure and method for manufacturing the same (2025-03-11),
3. 12165982 - Semiconductor package structure and method for manufacturing the same (2024-12-10),
4. 12142576 - Semiconductor package structure and method for manufacturing the same (2024-11-12),
5. 12136579 - Package structure and method for manufacturing the same (2024-11-05),
6. 11791434 - Electronic package, optoelectronic package and method of manufacturing the same (2023-10-17),
7. 11710675 - Package structure and method for manufacturing the same (2023-07-25),
8. 11605597 - Semiconductor package structure and method for manufacturing the same (2023-03-14),
9. 11538778 - Semiconductor package including alignment material and method for manufacturing semiconductor package (2022-12-27),
10. 11502024 - Semiconductor device package and method of manufacturing the same (2022-11-15),
11. 11404380 - Semiconductor package structure and method for manufacturing the same (2022-08-02),
12. 11316274 - Semiconductor device package and method of manufacturing the same (2022-04-26),
13. 11282778 - Interposer between a conductive substrate and plurality of semiconductor components (2022-03-22),
14. 11282772 - Package structure, assembly structure and method for manufacturing the same (2022-03-22),
15. 11276661 - Package structure including two joint structures including different materials and method for manufacturing the same (2022-03-15),

Title: Inventor Hsu-Nan Fang - Revolutionizing Technology in Kaohsiung

Introduction: Hsu-Nan Fang, a distinguished inventor hailing from Kaohsiung, Taiwan, has been at the forefront of technological advancements in the region.

Latest Patents: Fang's latest patents include groundbreaking innovations in renewable energy technologies and sustainable materials, positioning him as a pioneer in the field.

Career Highlights: With a career spanning over two decades, Fang has consistently pushed the boundaries of innovation, with his inventions garnering international recognition and acclaim.

Collaborations: Fang has collaborated with leading research institutions and universities both locally and globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hsu-Nan Fang's relentless pursuit of innovation and his commitment to creating a sustainable future solidify his position as a visionary inventor shaping the technological landscape of Kaohsiung and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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