The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Jun. 23, 2021
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Hsu-Nan Fang, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package structure and a method of manufacturing the same are provided. The semiconductor package structure includes an electronic component having a first surface, a second surface opposite to the first surface and a circuit structure closer to the first surface than to the second surface. The semiconductor package structure also includes a passive component connected to the second surface of the electronic component. The semiconductor package structure further includes a conductive element extending into the electronic component and configured to electrically connect the circuit structure with the passive component.