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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11282778 B1

PDFFull Text
Date of Patent:
Mar. 22, 2022

Filed:

Dec. 04, 2019

Interposer between a conductive substrate and plurality of semiconductor components

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Hsu-Nan Fang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H05K 7/00 (2006.01); H01R 9/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 21/6835 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/17 (2013.01); H01L 24/24 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01);
Abstract

A semiconductor device package includes a redistribution structure, a conductive substrate stacked on the redistribution structure and an encapsulant encapsulating the redistribution structure and the conductive substrate. The encapsulant encapsulates a side surface of the conductive substrate. A method for manufacturing an electronic device package includes: providing a carrier, forming a redistribution structure on the carrier, mounting a conductive substrate on a first surface of the redistribution structure, forming a first encapsulant to encapsulate the first surface of the redistribution structure and a side surface of the conductive substrate, and removing the carrier.

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