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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11282772 B1

PDFFull Text
Date of Patent:
Mar. 22, 2022

Filed:

Nov. 06, 2019

Package structure, assembly structure and method for manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Hsu-Nan Fang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Ahmed N Sefer

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/463 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01); H01L 23/14 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/463 (2013.01); H01L 21/4864 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/29 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/13 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 23/145 (2013.01); H01L 23/4334 (2013.01); H01L 2224/48165 (2013.01); H01L 2224/73207 (2013.01);
Abstract

A package structure includes at least one electronic device, a protection layer and an encapsulant. The electronic device has a first surface and includes a plurality of bumps disposed adjacent to the first surface thereof. Each of the bumps has a first surface. The protection layer covers the bumps and the first surface of the electronic device, and has a first surface. The encapsulant covers the protection layer and at least a portion of the electronic device, and has a first surface. The first surfaces of the bumps, the first surface of the protection layer and the first surface of the encapsulant are substantially coplanar with each other.

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