The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jun. 05, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Cheng-Nan Lin, Kaohsiung, TW;
Hsu-Nan Fang, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 13/18 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/18 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/295 (2013.01); H01L 23/315 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49816 (2013.01); H01L 23/66 (2013.01); H01Q 1/38 (2013.01); H01L 23/49822 (2013.01); H01L 2223/6677 (2013.01);
Abstract
A semiconductor device package includes a substrate, a first molding compound and antenna layer. The substrate has a first surface and a second surface opposite to the first surface. The first molding compound is disposed on the first surface of the substrate. The antenna layer is disposed on the first molding compound. The substrate, the first molding compound and the antenna layer define a cavity.