The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Jan. 21, 2020
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Hsu-Nan Fang, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first semiconductor element, a first redistribution layer, a second redistribution layer, and a conductive via. The first semiconductor element has a first active surface and a first back surface opposite to the first active surface. The first redistribution layer is disposed adjacent to the first back surface of the first semiconductor element. The second redistribution layer is disposed adjacent to the first active surface of the first semiconductor element. The conductive via is disposed between the first redistribution layer and the second redistribution layer, where the conductive via inclines inwardly from the second redistribution layer to the first redistribution layer.