The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
May. 22, 2020
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Hsu-Nan Fang, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); H01L 24/05 (2013.01); H01L 24/14 (2013.01); H01L 24/82 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/82214 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/18165 (2013.01);
Abstract
A package structure and a method for manufacturing a package structure are provided. The package structure includes a first wiring structure and at least one electronic device. The at least one electronic device is connected to the first wiring structure through at least two joint structures. The at least two joint structures respectively include different materials.