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For the Inventor, By the Inventor

Taipei, Taiwan

Hsu Chiang

This inventor holds 16 USPTO granted patents and 27 published patent applications, primarily in Semiconductor Technology. Top assignees: Micron Technology Incorporated, Inotera Memories, Inc., Nan Ya Technology Corporation. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsu Chiang. Retrieved from https://idiyas.com/inventor/hsu-chiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 43(Granted Patents)


Location History:

  • New Taipei, TW (2015 - 2022)
  • Taichung, TW (2024)

Company Filing History:

goldMedal6 out of 39,294 
 
Micron Technology Incorporated
 patents
silverMedal5 out of 123 
 
Inotera Memories, Inc.
 patents
bronzeMedal3 out of 2,600 
 
Nan Ya Technology Corporation
 patents
where one patent can have more than one assignee

Years Active: 2015-2026

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Areas of Expertise:
Semiconductor Structure
Microelectronic Devices
Redistribution Layers
Wafer Level Package
Fabrication Method
Memory Unit
Bit Line Structure
Pneumatic Tool
Power Ratchet Wrench
Device Manufacturing
TSV-less Interposer
Packaging Structures
16 patents (USPTO):Explore Patents
1. 12610535 - Semiconductor structure including a bit line structure and method of manufacturing the same (2026-04-21),
2. 12151341 - Power ratchet wrench head (2024-11-26),
3. 12059791 - Pneumatic tool (2024-08-13),
4. 11450553 - Semiconductor structure and method of forming the same (2022-09-20),
5. 11062984 - Methods for forming semiconductor devices (2021-07-13),
6. 10818536 - Microelectronic devices including redistribution layers (2020-10-27),
7. 10811420 - Semiconductor structure and method for forming the same (2020-10-20),
8. 10566229 - Microelectronic package structures including redistribution layers (2020-02-18),
9. 10121734 - Semiconductor device (2018-11-06),
10. 9916999 - Methods of fabricating a semiconductor package structure including at least one redistribution layer (2018-03-13),
11. 9748184 - Wafer level package with TSV-less interposer (2017-08-29),
12. 9520333 - Wafer level package and fabrication method thereof (2016-12-13),
13. 9496358 - Semiconductor device and fabrication method therefor (2016-11-15),
14. 9070782 - Semiconductor structure (2015-06-30),
15. 9070740 - Memory unit, memory unit array and method of manufacturing the same (2015-06-30),

Title: The Innovative Journey of Inventor Hsu Chiang

Introduction:

Hsu Chiang, a visionary inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and inventions.

Latest Patents:

Hsu Chiang's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and sustainable agriculture, showcasing his versatility and forward-thinking approach.

Career Highlights:

Throughout his illustrious career, Hsu Chiang has been recognized for his pioneering work in developing eco-friendly solutions for urban living, earning him prestigious awards and accolades in the industry.

Collaborations:

Hsu Chiang has collaborated with leading research institutions, universities, and tech companies worldwide to further his inventions and bring them to the market, solidifying his reputation as a trailblazer in the innovation landscape.

Conclusion:

Inventor Hsu Chiang's relentless pursuit of innovation and commitment to creating a more sustainable future through his inventions continue to inspire and shape the technological landscape, making him a true visionary in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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