The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jan. 20, 2016
Micron Technology, Inc., Boise, ID (US);
Tzung-Han Lee, Taipei, TW;
Yaw-Wen Hu, Taoyuan, TW;
Neng-Tai Shih, New Taipei, TW;
Hsu Chiang, New Taipei, TW;
Hsin-Chuan Tsai, Taoyuan, TW;
Sheng-Hsiung Wu, Taipei, TW;
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor device includes a substrate, and interposer layers. The substrate has a first region, and a second region adjacent the first region. The interposer layers are sequentially stacked on the substrate. Each of the interposer layers has an active region and an open region, which respectively correspond to the first region and the second region of the substrate. Each of the interposer layers includes a device layout pattern, and a stress release structure. The device layout pattern is formed within the active region. The stress release structure is formed within the open region, and includes openings.