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For the Inventor, By the Inventor

Taipei, Taiwan

Neng-Tai Shih

This inventor holds 17 USPTO granted patents and 6 published patent applications. Top assignees: Micron Technology Incorporated, Inotera Memories, Inc., Other. Active years: 2015-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Neng-Tai Shih. Retrieved from https://idiyas.com/inventor/neng-tai-shih

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 5

Forward Citations = 99(Granted Patents)


Company Filing History:

goldMedal10 out of 39,222 
 
Micron Technology Incorporated
 patents
silverMedal6 out of 123 
 
Inotera Memories, Inc.
 patents
bronzeMedal1 out of 834,513 
Other
 patents

Years Active: 2015-2025

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17 patents (USPTO):Explore Patents
1. 12295185 - Epitaxial substrate having a 2D material interposer, method for manufacturing the epitaxial substrate, and device prepared from the epitaxial substrate (2025-05-06),
2. 11735540 - Apparatuses including dummy dice (2023-08-22),
3. 11062984 - Methods for forming semiconductor devices (2021-07-13),
4. 10937749 - Methods of forming microelectronic devices including dummy dice (2021-03-02),
5. 10818536 - Microelectronic devices including redistribution layers (2020-10-27),
6. 10566229 - Microelectronic package structures including redistribution layers (2020-02-18),
7. 10446509 - Methods of forming and operating microelectronic devices including dummy chips (2019-10-15),
8. 10121734 - Semiconductor device (2018-11-06),
9. 10043769 - Semiconductor devices including dummy chips (2018-08-07),
10. 9916999 - Methods of fabricating a semiconductor package structure including at least one redistribution layer (2018-03-13),
11. 9748106 - Method for fabricating semiconductor package (2017-08-29),
12. 9520333 - Wafer level package and fabrication method thereof (2016-12-13),
13. 9496358 - Semiconductor device and fabrication method therefor (2016-11-15),
14. 9455243 - Silicon interposer and fabrication method thereof (2016-09-27),
15. 9449953 - Package-on-package assembly and method for manufacturing the same (2016-09-20),

Title: Inventor Neng-Tai Shih: Revolutionizing Technology in New Taipei

Introduction: Neng-Tai Shih is a visionary inventor based in New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Neng-Tai Shih holds several patents in the areas of electronics, robotics, and artificial intelligence, showcasing his expertise and creativity in developing cutting-edge solutions.

Career Highlights: With a career spanning over two decades, Neng-Tai Shih has worked with leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have pushed the boundaries of technological advancement.

Collaborations: Throughout his career, Neng-Tai Shih has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge exchange that has led to groundbreaking inventions.

Conclusion: Neng-Tai Shih's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his reputation as a pioneering inventor in New Taipei and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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