Hsinchu, Taiwan

Horng-Huei Tseng

This inventor holds 411 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Technology (CPC class H01L29-66545). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Vanguard International Semiconductor Corporation, Industrial Technology Research Institute. Active years: 1992-2026.

USPTO Granted Patents = 411 

% Patents Active = 95.9

Average Co-Inventor Count = 1.6

ph-index = 24

Forward Citations = 3,191(Granted Patents)

Forward Citations (Not Self Cited) = 3,004(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsin, TW (1995)
  • Hsinchu 300, TW (2004)
  • HsinChu City, TW (2008)
  • Hsinchu, TW (1992 - 2024)

Company Filing History:


Years Active: 1992-2026

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Areas of Expertise:
FinFET Devices
Integrated Circuits
Semiconductor Structures
Fabrication Methods
Dielectric Layers
Interconnection Structures
Source/Drain Regions
Gate Stacks
Optical Performance
High Dielectric Constant
411 patents (USPTO):Explore Patents

Title: Horng-Huei Tseng: Innovator Extraordinaire

Introduction:

In the world of semiconductor technology and electronic devices, Horng-Huei Tseng stands out as a prolific inventor and pioneer. Hailing from Hsinchu, Taiwan, Tseng has made significant contributions to the field through his extensive patent portfolio and groundbreaking inventions. This article will delve into his latest patents, career highlights, collaborations, and celebrate his remarkable achievements.

Latest Patents:

Tseng's recent patents showcase his expertise in improving the interconnection structure and optical performance of semiconductor devices. One notable invention is an interconnection structure that incorporates a textured surface and sputter ions. This ingenious design enhances the contact area and reduces resistance, ultimately improving the overall efficiency of the semiconductor device.

Another noteworthy invention is Tseng's stacked grid design for back side illumination (BSI) image sensors. By employing a dielectric grid with a planar lower surface, Tseng has optimized optical performance and isolation in BSI sensors. This innovation has paved the way for enhanced image quality and improved sensor functionality in various electronic devices.

Career Highlights:

Throughout his distinguished career, Tseng has worked with industry-leading companies, including Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Vanguard International Semiconductor Corporation (VIS). His exceptional contributions to these organizations have solidified his reputation as an innovator and thought leader in semiconductor technology.

Collaborations:

Tseng's innovative spirit extends beyond his solo endeavors. He has collaborated with notable individuals in the industry, including Che-Cheng Chang and Chih-Han Lin. These collaborations have fostered a culture of innovation, enabling Tseng and his colleagues to push the boundaries of technological advancements.

Conclusion:

Horng-Huei Tseng's remarkable achievements in the realm of innovations and patents have undoubtedly left an indelible mark on the semiconductor industry. With an extensive patent portfolio consisting of 397 patents, Tseng's commitment to pushing the boundaries of technology is evident. His recent patents, focused on improving interconnection structures and enhancing optical performance, have further cemented his status as a trailblazer. As Tseng continues to innovate and inspire, we eagerly anticipate the exciting developments and breakthroughs he will bring to the world of technology.

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