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For the Inventor, By the Inventor

Fremont, CA, United States of America

Hong Shi

USPTO Granted Patents = 34 

 

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 140(Granted Patents)


Location History:

  • Santa Clara, CA (US) (2008)
  • Santa Rosa, CA (US) (2007 - 2015)
  • San Jose, CA (US) (2016)
  • Fremont, CA (US) (2012 - 2022)
  • Los Gatos, CA (US) (2023 - 2024)

Company Filing History:

goldMedal23 out of 4,283 
 
Altera Corporation
 patents
silverMedal10 out of 5,002 
 
Xilinx, Inc.
 patents
bronzeMedal1 out of 1 
 
Altera Corportation
 patent

Years Active: 2007-2025

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34 patents (USPTO):
1. 12354978 - Coupled loop and void structure integrated in a redistribution layer of a chip package (2025-07-08),
2. 12136613 - Chip package with near-die integrated passive device (2024-11-05),
3. 11950358 - Integrated circuit package with voltage droop mitigation (2024-04-02),
4. 11735519 - In-package passive inductive element for reflection mitigation (2023-08-22),
5. 11688675 - Core cavity noise isolation structure for use in chip packages (2023-06-27),
6. 11302674 - Modular stacked silicon package assembly (2022-04-12),
7. 11043484 - Method and apparatus of package enabled ESD protection (2021-06-22),
8. 10770364 - Chip scale package (CSP) including shim die (2020-09-08),
9. 10314163 - Low crosstalk vertical connection interface (2019-06-04),
10. 10057976 - Power-ground co-reference transceiver structure to deliver ultra-low crosstalk (2018-08-21),
11. 9536820 - Power distribution network (2017-01-03),
12. 9425149 - Integrated circuit package routing with reduced crosstalk (2016-08-23),
13. 9401330 - IC package with non-uniform dielectric layer thickness (2016-07-26),
14. 9331014 - Tunable power distribution network and method of use thereof (2016-05-03),
15. 9245835 - Integrated circuit package with reduced pad capacitance (2016-01-26),

As a client, I appreciate your interest in inventor Hong Shi. Below is the article based on the data provided:

Title: The Innovative Work of Inventor Hong Shi

Introduction:

Inventor Hong Shi, based in Fremont, CA, has made significant contributions to the field of technology with an impressive portfolio of 31 patents. His inventive spirit and dedication to innovation shine through in his latest patents, showcasing his expertise in cutting-edge technologies.

Latest Patents:

1. "In-package Passive Inductive Element for Reflection Mitigation": Hong Shi's patent introduces a package device that includes innovative passive inductive elements to mitigate reflections. This groundbreaking technology is poised to revolutionize communication systems.

2. "Core Cavity Noise Isolation Structure for Use in Chip Packages": Another of Hong Shi's patents focuses on noise isolation structures within chip packages. This invention demonstrates his commitment to enhancing the performance and reliability of electronic devices.

Career Highlights:

Hong Shi is a valuable asset to Altera Corporation, where he channels his creativity and technical prowess to drive advancements in the industry. His expertise in chip packages and communication systems has solidified his reputation as a trusted innovator.

Collaborations:

In his professional journey, Hong Shi has collaborated closely with esteemed colleagues such as Xiaohong Jiang and Yuanlin Xie. Together, they have fostered a culture of innovation and excellence within Altera Corporation, driving the company towards continued success.

Conclusion:

In conclusion, Hong Shi's remarkable journey as an inventor underscores his passion for pushing the boundaries of technology. His latest patents and collaborations exemplify his dedication to creating solutions that shape the future of the industry. Hong Shi's contributions stand as a testament to the power of innovation and ingenuity in driving progress forward.

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