The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Jun. 24, 2021
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Zhaoyin Daniel Wu, Los Gatos, CA (US);

Parag Upadhyaya, Los Gatos, CA (US);

Hong Shi, Los Gatos, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A package device comprises a first transceiver comprising a first integrated circuit (IC) die and transmitter circuitry, and a second transceiver comprising a second IC die and receiver circuitry. The receiver circuitry is coupled to the transmitter circuitry via a channel. The package device further comprises an interconnection device connected to the first IC die and the second IC die. The interconnection device comprises a channel connecting the transmitter circuitry with the receiver circuitry, and a passive inductive element disposed external to the first IC die and the second IC die and along the channel.


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