The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Oct. 13, 2009
Xiaohong Jiang, San Jose, CA (US);
Hong Shi, San Jose, CA (US);
Hui Liu, Pleasanton, CA (US);
Yuanlin Xie, Fremont, CA (US);
Xiaohong Jiang, San Jose, CA (US);
Hong Shi, San Jose, CA (US);
Hui Liu, Pleasanton, CA (US);
Yuanlin Xie, Fremont, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
An integrated circuit (IC) package substrate with non-uniform dielectric layers is disclosed. The IC package substrate is a multilayer package substrate that has dielectric layers and metal layers stacked up alternately. The dielectric layers in the package substrate have different thickness. The metal layers may be ground, signal or power layers. A thicker dielectric layer is placed in between a signal layer and a power layer in the package substrate. The thicker dielectric layer may be at least twice as thick as other dielectric layers in the package substrate. The thicker dielectric layer may provide better impedance control in the package substrate.