San Jose, CA, United States of America

Xiaohong Jiang

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 2.2

ph-index = 5

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 2010-2024

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13 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Inventor Xiaohong Jiang

Introduction

Xiaohong Jiang is a prominent inventor based in San Jose, California. He has made significant contributions to the field of electronic packaging and integrated circuit design. With a total of 13 patents to his name, Jiang's work has had a substantial impact on the industry.

Latest Patents

One of Jiang's latest patents is a package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost. This invention includes electronic packages and methods of forming such packages. In this embodiment, the electronic package comprises a first trace embedded in a package substrate, which features a first region with a wider width and a second region with a narrower width. Another notable patent is for magnetically decoupled inductor structures. In this embodiment, an integrated circuit die includes first and second inductor structures, along with ground conductors and a conductive trace that magnetically decouples the inductor structures. The design also incorporates conductive guard ring structures that enhance the magnetic decoupling of the inductor structures.

Career Highlights

Throughout his career, Xiaohong Jiang has worked with leading technology companies, including Altera Corporation and Intel Corporation. His experience in these organizations has allowed him to develop innovative solutions that address complex engineering challenges.

Collaborations

Jiang has collaborated with several talented individuals in his field, including Hong Shi and Yuanlin Xie. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Xiaohong Jiang's contributions to electronic packaging and integrated circuit design demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing technology and improving manufacturing processes.

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