The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jul. 31, 2013
Altera Corporation, San Jose, CA (US);
Xiaohong Jiang, San Jose, CA (US);
Hong Shi, Fremont, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
An integrated circuit package having a package substrate, an integrated circuit, and at least one solder ball is provided. The package substrate has first and second surfaces. The integrated circuit may be mounted on the first surface of the package substrate. The solder ball may be coupled to the second surface of the package substrate. The package substrate may include a substrate layer. The substrate layer may include a ground plane with an opening. The opening may be formed just above the solder ball. In one instance, the diameter of the opening is greater than the diameter of the solder ball pad.