Fremont, CA, United States of America

Yuanlin Xie

This inventor holds 24 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Integrated Circuit Packaging. Top assignee: Altera Corporation. Active years: 2007-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuanlin Xie. Retrieved from https://idiyas.com/inventor/yuanlin-xie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 41.7

 

Average Co-Inventor Count = 1.9

ph-index = 6

Forward Citations = 125(Granted Patents)


Location History:

  • Femont, CA (US) (2011)
  • Fremont, CA (US) (2007 - 2018)

Company Filing History:


Years Active: 2007-2018

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Areas of Expertise:
Integrated Circuit Packages
Detachable Interconnects
Power Distribution Network
Ball Grid Array
Embedded Passive Structures
Fluid Flow Barriers
Via Structure
Stacked Electronic Circuitry
Non-Uniform Dielectric Layer
Cavity in Substrate
Noise Reduction Techniques
Signal Integrity Optimization
24 patents (USPTO):Explore Patents

Title: Innovations of Yuanlin Xie: A Pioneer in Integrated Circuit Technologies

Introduction: Yuanlin Xie, based in Fremont, California, is an influential inventor in the field of integrated circuit technology, boasting an impressive portfolio of 24 patents. His work primarily focuses on advancements in integrated circuit packages and interconnect structures, propelling innovation in the electronics industry.

Latest Patents: Among Yuanlin Xie's latest patents are groundbreaking designs such as "Integrated Circuit Packages with Detachable Interconnect Structures." This patent outlines an integrated circuit package that integrates two dies with a detachable interconnect structure, allowing for efficient electrical communication and enhanced testing capabilities before packaging.

Another notable patent is the "Transmission Line Bridge Interconnects," which describes an integrated circuit package featuring a package substrate, printed circuit board, and a specially designed interposer structure. This invention allows for improved signal conveyance through low parasitic inductance transmission lines and minimizes dimensional discontinuity, ultimately enhancing the performance of circuit systems.

Career Highlights: Yuanlin Xie has made significant contributions to the field of electronics during his tenure at Altera Corporation, a leading company in programmable logic devices. His innovative designs have not only advanced the capabilities of integrated circuits but also impacted overall circuit system performance.

Collaborations: Throughout his career, Yuanlin has collaborated with other skilled professionals, including Hong Shi and Yuan Hang Li. These partnerships have fostered an environment of creativity and knowledge sharing, further enhancing the development of cutting-edge technologies within the company.

Conclusion: Yuanlin Xie continues to be a prominent figure in the field of integrated circuits, with his 24 patents showcasing his dedication to innovation. His contributions at Altera Corporation and collaborations with talented individuals play a vital role in shaping the future of electronics, making him a noteworthy inventor in today's technological landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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