The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Jan. 17, 2014
Altera Corporation, San Jose, CA (US);
Yuanlin Xie, Fremont, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
A two-dimensional array of bonding pads is formed on a first major surface of a substrate. At least some of the pads are connected to conductors that extend across or into the substrate. The pads can be classified in two groups. A first group is conventional, each pad providing a continuous electrically conductive surface on which a solder ball or solder bump may be formed. In the second group, each pad has a plurality of isolated electrically conductive regions that are connected to different conductors that extend across or into the substrate. Solder balls or solder bumps having a first height are mounted on some of the pads. Multi-terminal devices that have a height that is no more than that of the first height are mounted on at least some of the second group of pads; and their terminals are connected to different electrically conductive regions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile