The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Feb. 04, 2013
Altera Corporation, San Jose, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
Integrated circuit packages with heat dissipation function are disclosed. A disclosed integrated circuit package includes a first die attached on a top surface of a second die. The second die may be coupled to a thermally conductive block. The thermally conductive block may be embedded in a cavity formed in a package substrate. A heat spreading lid may be disposed over the package substrate. The integrated circuit package may be disposed on a printed circuit substrate via solder bumps or balls. The printed circuit substrate may have heat dissipation paths to dissipate heat from the integrated circuit package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile