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Hitoshi Morinaga

USPTO Granted Patents = 17 (Patent Applications = 5)

EPO Patents = 8 (Patent Applications = 20)

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 52(Granted Patents)

Location History:

Kitakyushu, JP (1994)
Ichinomiya, JP (2012 - 2014)
Kiyosu, JP (2014 - 2022)
Aichi, JP (2019 - 2022)

Company Filing History:

Fujimi Incorporated

Ebara Corporation

where one patent can have more than one assignee

Years Active: 1994-2022

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11498182 - Polishing method and polishing pad (2022-11-15),

2. 11446784 - Chemical mechanical polishing apparatus for polishing workpiece (2022-09-20),

3. 10920104 - Abrasive, polishing composition, and polishing method (2021-02-16),

4. 10882157 - Polishing pad and polishing method (2021-01-05),

5. 10835805 - Sliding instrument and method for manufacturing same (2020-11-17),

6. 10450651 - Article comprising metal oxide-containing coating (2019-10-22),

7. 10434622 - Polishing tool and polishing method for member having curved surface shape (2019-10-08),

8. 9994748 - Polishing composition (2018-06-12),

9. 9879156 - Polishing composition (2018-01-30),

10. 9157011 - Polishing composition (2015-10-13),

11. 9149744 - Filtration method, method for purifying polishing composition using it, method for regenerating filter to be used for filtration, and filter regenerating apparatus (2015-10-06),

12. 9028709 - Surface treatment composition and surface treatment method using same (2015-05-12),

13. 9028574 - Polishing composition (2015-05-12),

14. 8702472 - Polishing composition and polishing method using the same (2014-04-22),

15. 8632693 - Wetting agent for semiconductors, and polishing composition and polishing method employing it (2014-01-21),

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