The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Jul. 01, 2009
Hitoshi Morinaga, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Shogaku Ide, Kiyosu, JP;
Tomohiro Imao, Kiyosu, JP;
Naoyuki Ishihara, Kiyosu, JP;
Hitoshi Morinaga, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Shogaku Ide, Kiyosu, JP;
Tomohiro Imao, Kiyosu, JP;
Naoyuki Ishihara, Kiyosu, JP;
Fujimi Incorporated, Kiyosu-shi, JP;
Abstract
To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced. A wetting agent for semiconductors, comprising a water soluble polymer compound having a low viscosity and water, and a polishing composition. A 0.3 wt % aqueous solution of the water soluble polymer compound has a viscosity of less than 10 mPa·s at 25° C.