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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9879156 B1

PDFFull Text
Date of Patent:
Jan. 30, 2018

Filed:

Feb. 07, 2014

Polishing composition

Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Jun Ito, Kiyosu, JP;

Kazutoshi Hotta, Kiyosu, JP;

Hiroyasu Sugiyama, Kiyosu, JP;

Hitoshi Morinaga, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu-shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Stephanie Duclair

Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); B44C 1/22 (2006.01); C23F 1/00 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C25F 3/00 (2006.01); C09G 1/02 (2006.01); C09G 1/00 (2006.01); H01L 21/306 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01); C09K 3/14 (2006.01); B24B 37/00 (2012.01); C30B 29/20 (2006.01); C30B 33/00 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09K 3/1409 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C30B 29/20 (2013.01); C30B 33/00 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract

Provided is a polishing composition which can polish a sapphire substrate having a non-polar plane or a semi-polar plane at a high polishing rate. The invention is a polishing composition used in an application to polish a sapphire substrate having a non-polar plane or a semi-polar plane, the polishing composition containing colloidal silica particles and water, in which a value obtained by dividing a specific surface area (unit: m/g) of the colloidal silica particles by a number average particle diameter (unit: nm) of the colloidal silica particles, that is, (specific surface area/number average particle diameter) is 0.5 or more and 3.0 or less.

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