The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
May. 15, 2019
Ebara Corporation, Tokyo, JP;
Fujimi Incorporated, Kiyosu, JP;
Yu Ishii, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Hitoshi Morinaga, Kiyosu, JP;
Kazusei Tamai, Kiyosu, JP;
Shingo Ohtsuki, Kiyosu, JP;
Hiroshi Asano, Kiyosu, JP;
EBARA CORPORATION, Tokyo, JP;
FUJIMI INCORPORATED, Kiyosu, JP;
Abstract
The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad () having an annular polishing surface () which has a curved vertical cross-section; a workpiece holder () for holding a workpiece (W) having a polygonal shape; a rotating device () configured to rotate the workpiece holder () about an axis of the workpiece (W); a pressing device () configured to press a periphery of the workpiece (W) against the annular polishing surface (); and an operation controller () configured to change a speed at which the rotating device () rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device () is disposed more inwardly than the workpiece holder () in a radial direction of the polishing table ().